Der CoolGaN Bidirectional Switch (BDS) 650 V G5 von Infineon kann zwei herkömmliche Schalter ersetzen und reduziert so die Anzahl der Bauteile, Kosten, Größe und Gesamtverlustleistung. Foto: Infineon
Infineon Technologies and Visteon Corporation have signed a Memorandum of Understanding (MOU) to jointly develop next-generation powertrains for electric vehicles. As part of the collaboration, Infineon and Visteon will develop and integrate power converters based on Infineon semiconductors. The focus is on wide bandgap (WBG) device technologies, which offer significant advantages over silicon-based semiconductors in terms of energy conversion. These include a higher power density, higher efficiency and better thermal performance. The components therefore contribute to improved efficiency and lower system costs in next-generation power converter modules for the automotive sector.
Visteon’s future powertrain applications for electric vehicles equipped with Infineon’s CoolGaN (gallium nitride) and CoolSiC (silicon carbide) components could include battery junction boxes, DC/DC converters and on-board chargers. The resulting powertrain systems will meet the highest standards of efficiency, robustness and reliability.
‘By working with Infineon, we can integrate cutting-edge semiconductor technologies that are essential for improving the power conversion efficiency and overall system performance of next-generation electric vehicles,’ said Dr Tao Wang, head of Visteon Corporation’s Electrification product line. ‘With this collaboration, we will advance technologies that accelerate the transition to a more sustainable and efficient mobility ecosystem.’
“Visteon is a recognised innovator that is an early adopter of new technologies. That’s why the company is an ideal partner for us,” says Peter Schaefer, Chief Sales Officer Automotive at Infineon. ‘Together, we will continue to expand the possibilities of electric vehicle technology and offer first-class solutions to the global automotive industry.’
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