Winner 2019 Category: Surface & Technology


Telsonic AG

The unique ultrasonic joining process

The technology developed and proven by Telsonic supports the trending topic of lightweight construction in an impressive manner. Weldable materials are connected gently, without markings on Class-A surfaces with material thicknesses less than 2.5 mm, process stable with short cycle times and free of consumables. The process offers the developer great potential for new materials and design requirements that previously were considered difficult to weld. SONIQTWIST® enables both plastic and metal connections. This results in completely new applications. Numerous applications in various industries are prove of the high acceptance of this technology.